SKU:44793189555
High Open Area Grids 3.00-3.05mm Diameter
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USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Aug 5 - Aug 10
Description
High Open Area Grids 3.00-3.05mm Diameter200 Mesh Grids with High Open Area 11G_200 Material Part number Copper 11GC200 400 Mesh Grids with High Open Area 11G_400 Bar Thickness: 0017mm+ 0. 003mm Hole Size: 0. 047mm+ 0. 003mm Material Part number Copper 11GC400
5-Disc GSR Field Kit
(Chip size 3
(Wedge Tip) 12 µm (overall)
Diameter of holder is 25
5cm (7-11/16") H
Made of aluminum
Silicon Carbide Grinding Powders
Material Part number Copper 7HXC100 Nickel 7HXN100 Pattern Pitch microns Mesh Hole microns Bar microns Transmission % Tolerance +/-microns 7HX_100 254 100 200 54 65 3
4" wafer precut into 5 x 7mm chips approximately 187 chips/wafer
ø25mm (1") x 17
Ideal for correlative microscopy
The discs are supplied in PELCO® AFM/STM Disc Carriers
Quick Dispatch:
Your High Open Area Grids 3.00-3.05mm Diameter orders ship within 1-2 business days.
Delivery Options:
- Standard: 3-7 business days
- Fast: 2-3 business days
- Express: 1-2 business days
Order Tracking:
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Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
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